[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - An Experimental Study of Spray Cooling of a Flip Chip
Tay, Andrew A. O., Lin, Carol Chin Tze, Yang, Gao Xiang, Somasundaram, SivanandYear:
2007
Language:
english
DOI:
10.1109/eptc.2007.4469844
File:
PDF, 514 KB
english, 2007