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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - An Experimental Study of Spray Cooling of a Flip Chip

Tay, Andrew A. O., Lin, Carol Chin Tze, Yang, Gao Xiang, Somasundaram, Sivanand
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Year:
2007
Language:
english
DOI:
10.1109/eptc.2007.4469844
File:
PDF, 514 KB
english, 2007
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