On the Assessment of the Life of SnAgCu Solder Joints in...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 03 Vol. 3; Iss. 3

On the Assessment of the Life of SnAgCu Solder Joints in Cycling With Varying Amplitudes

Linlin Yang,, Liang Yin,, Arafei, Babak, Roggeman, Brian, Borgesen, Peter
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2238234
Date:
March, 2013
File:
PDF, 2.57 MB
english, 2013
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