[IEEE Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium - San Francisco, CA, USA (16-18 Sept. 1991)] [1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium - The key sputter deposition step in TAB wafer bump processing: optimizing TiW adhesion and diffusion barrier properties

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.