Patterned electrochemical deposition of copper using an...

APL Materials 2014 / 02 Vol. 2; Iss. 2

Patterned electrochemical deposition of copper using an electron beam

den Heijer, Mark, Shao, Ingrid, Radisic, Alex, Reuter, Mark C., Ross, Frances M.
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Volume:
2
Language:
english
Journal:
APL MATERIALS
DOI:
10.1063/1.4863596
Date:
February, 2014
File:
PDF, 1.22 MB
english, 2014
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