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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - New 3D Chip Stacking SIP Technology by Wire-On-Bump (WOB) and Bump-On-Flex (BOF)
Baik-Woo Lee,, Jui-Yun Tsai,, Hotae Jin,, Yoon, C.K., Tummala, R.R.Year:
2006
Language:
english
DOI:
10.1109/ectc.2006.1645752
File:
PDF, 1.32 MB
english, 2006