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A Finite-Element-Based Methodology for Evaluating Solder Electromigration Current Limits of Sn/Pb Eutectic Solder Bumps
Dauksher, W., Eaton, D.H., Rowatt, J.D.Volume:
8
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2008.915626
Date:
March, 2008
File:
PDF, 447 KB
english, 2008