Analysis of creep due to grain-boundary diffusion in...

Analysis of creep due to grain-boundary diffusion in hexagonal microstructures

Kim †, B.-N., Hiraga, K., Morita, K., Ahn, B.-W.
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Volume:
84
Language:
english
Journal:
Philosophical Magazine
DOI:
10.1080/14786430412331284289
Date:
October, 2004
File:
PDF, 355 KB
english, 2004
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