A New Circuit Augmentation Method for Modeling of Interconnects and Passive Components
Kolstad, J., Blevins, C., Dunn, J.M., Weisshaar, A.Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.862643
Date:
February, 2006
File:
PDF, 894 KB
english, 2006