[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Wafer thinning and back side processing to enable 3D stacking
Detalle, M., Manna, A. La, Buisson, T., Velenis, D., Beyne, E.Year:
2012
Language:
english
DOI:
10.1109/estc.2012.6542113
File:
PDF, 2.06 MB
english, 2012