[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - 2.0mils au wire wedge bonding process characterization to eliminate lift bond on accelerometer device
ZhiJie, Wang, ZhiGang, Bai, Lee, Ben, Choi, H.S., Kwang, K.S.Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582392
File:
PDF, 2.87 MB
english, 2010