![](/img/cover-not-exists.png)
[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Size and geometry effects on microstructural evolution in Sn microbumps during isothermal aging
Xiong, Hua, Huang, Zhiheng, Conway, PaulYear:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745764
File:
PDF, 1.58 MB
english, 2013