[IEEE 2013 IEEE 15th Electronics Packaging Technology...

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[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Size and geometry effects on microstructural evolution in Sn microbumps during isothermal aging

Xiong, Hua, Huang, Zhiheng, Conway, Paul
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Year:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745764
File:
PDF, 1.58 MB
english, 2013
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