[IEEE 2005 6th International Conference on Electronics...

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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

Yang, D.G., Jansen, K.M.B., Ernst, L.J., Zhang GQ,, Beijer, J.G.J., Janssen, J.H.J.
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Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564637
File:
PDF, 579 KB
english, 2005
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