Reliability Research on the Thermal Deformation and Stress...

IEEE Transactions on Components and Packaging Technologies 2008 Vol. 31; Iss. 1

Reliability Research on the Thermal Deformation and Stress of Metal Packaging With Low-Resistance Leads

Rui Bai,, Jun Long Bie,, Xue Wei Sun,, Song Liang Jia,, Xi De Li,
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Volume:
31
Year:
2008
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.916795
File:
PDF, 2.12 MB
english, 2008
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