Development of new no-flow underfill materials for both...

IEEE Transactions on Components and Packaging Technologies 2003 / 06 Vol. 26; Iss. 2

Development of new no-flow underfill materials for both eutectic Sn-Pb solder and a high temperature melting lead-free solder

Li, H., Johnson, A., Wong, C.P.
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Volume:
26
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2003.815094
Date:
June, 2003
File:
PDF, 693 KB
english, 2003
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