[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China...

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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Formation of double-layer Cu3Sn in solid-state aging process at the interface of eutectic SnBi solder and (100) single crystal Cu

Pan-Ju Shang,, Zhi-Quan Liu,, Dou-Xing Li,, Jian-Ku Shang,
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Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607061
File:
PDF, 2.02 MB
english, 2008
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