Cryogenic packaging for multi-GHz electronics

IEEE Transactions on Appiled Superconductivity 1999 / 6 Vol. 9; Iss. 2

Cryogenic packaging for multi-GHz electronics

Tighe, T.S., Akerling, G., Smith, A.D.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
9
Language:
english
Journal:
IEEE Transactions on Appiled Superconductivity
DOI:
10.1109/77.783703
Date:
June, 1999
File:
PDF, 391 KB
english, 1999
Conversion to is in progress
Conversion to is failed