[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Optimization of Cu electrodeposition parameters for Through Silicon Via (TSV)
Sang-Soo Noh,, Eun-Hey Choi,, Yong-Hyuk Lee,, Hyun-jin Ju,, Sa-Kyun Rha,, Boung-ju Lee,, Dong-Kyu Kim,, Youn-Seoung Lee,Year:
2011
Language:
english
DOI:
10.1109/ipfa.2011.5992776
File:
PDF, 994 KB
english, 2011