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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Next Generation ASIC Packaging for High Performance Switches and Routers
Brillhart, MarkYear:
2006
DOI:
10.1109/emap.2006.4430560
File:
PDF, 12.18 MB
2006