[IEEE 2013 IEEE 63rd Electronic Components and Technology...

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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - The growth and segregation of intermetallic compounds in the bulk of flip chip Sn2.4Ag solder joint under electrical current stressing

Wang, Wei-Chieh, Lin, Kwang-Lung, Chiu, Ying-Ta, Lai, Yi-Shao
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Year:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575785
File:
PDF, 2.94 MB
english, 2013
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