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Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
Lu, Su-Tsai, Juang, Jing-Ye, Cheng, Hsien-Chie, Tsai, Yu-Ming, Chen, Tai-Hong, Chen, Wen-HwaVolume:
12
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2012.2187449
Date:
June, 2012
File:
PDF, 1.20 MB
english, 2012