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[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - A Study in Establishing Flip-Chip Ball Grid Array (FCBGA) Second Level Interconnect (SLI) Reliability Requirement by CFD Simulation
Lee Eng Kwong,, Tan Wooi Aun,Year:
2005
Language:
english
DOI:
10.1109/emap.2005.1598278
File:
PDF, 2.50 MB
english, 2005