Bilayer Graphene/Copper Hybrid On-Chip Interconnect: A...

IEEE Transactions on Nanotechnology 2011 / 07 Vol. 10; Iss. 4

Bilayer Graphene/Copper Hybrid On-Chip Interconnect: A Reliability Study

Yu, Tianhua, Lee, Eun-Kyu, Briggs, Benjamin, Nagabhirava, Bhaskar, Yu, Bin
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Volume:
10
Language:
english
Journal:
IEEE Transactions on Nanotechnology
DOI:
10.1109/tnano.2010.2071395
Date:
July, 2011
File:
PDF, 642 KB
english, 2011
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