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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Mathematical model of heat and mass transfer in a wick structure of a loop heat pipe
Fang-Chou Lin,, Chien-Chih Yeh,, Shen-Chun Wu,, Yau-Ming Chen,Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382190
File:
PDF, 1.40 MB
english, 2009