Solder bump reliability-issues on bump layout

IEEE Transactions on Advanced Packaging 2000 / Nov. Vol. 23; Iss. 4

Solder bump reliability-issues on bump layout

Ristolainen, E., Heino, P., Alander, T.
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.883763
Date:
January, 2000
File:
PDF, 98 KB
english, 2000
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