![](/img/cover-not-exists.png)
[IEEE 2013 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC) - Hong Kong, Hong Kong (2013.06.3-2013.06.5)] 2013 IEEE International Conference of Electron Devices and Solid-state Circuits - Ultra-thin chips for flexible electronics
Burghartz, J. N., Angelopoulos, E., Appel, W., Endler, S., Ferwana, S., Harendt, C., Hassan, M.-U., Rempp, H., Richter, H., Zimmermann, M.Year:
2013
Language:
english
DOI:
10.1109/edssc.2013.6628168
File:
PDF, 321 KB
english, 2013