[IEEE 2013 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Nara, Japan (2013.12.12-2013.12.15)] 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) - Comparing fast convolution and model order reduction methods for S-parameter simulation
Schutt-Aine, Jose E., Goh, PatrickYear:
2013
Language:
english
DOI:
10.1109/edaps.2013.6724407
File:
PDF, 211 KB
english, 2013