[IEEE 2013 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2013 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Nara, Japan (2013.12.12-2013.12.15)] 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) - Comparing fast convolution and model order reduction methods for S-parameter simulation

Schutt-Aine, Jose E., Goh, Patrick
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Year:
2013
Language:
english
DOI:
10.1109/edaps.2013.6724407
File:
PDF, 211 KB
english, 2013
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