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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - BGA lead-free C5 solder system improvement by Germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy
Leng, Eu Poh, Ling, Wong Tzu, Amin, Nowshad, Ahmad, Ibrahim, Han, Tay Yee, Chiao, Chin Wen, Haseeb, A.S.M.A.Year:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416568
File:
PDF, 1.85 MB
english, 2009