[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Development of Reliability Verification System for Robust Package Design
Shin, Dongkil, Baek, Hyunggil, Oh, Joonyoung, Kwak, Dongok, Kim, Kuyoung, Song, Younghee, Kim, JeongyeolYear:
2007
Language:
english
DOI:
10.1109/esime.2007.360020
File:
PDF, 7.84 MB
english, 2007