[IEEE 2008 33rd IEEE/CPMT International Electronics...

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[IEEE 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Penang, Malaysia (2008.11.4-2008.11.6)] 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Electrical characterization of through silicon via (TSV) for high-speed memory application

Terry Hsu,, Kevin Chiang,, Jeng-Yuan Lai,, Yu-Po Wang,
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Year:
2008
Language:
english
DOI:
10.1109/iemt.2008.5507818
File:
PDF, 2.03 MB
english, 2008
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