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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Reliability Characterization of Ni-based Microinsert Interconnections for Flip Chip Die on Wafer Attachment and Their Evaluation in Multichip SIMCARD Prototype
Boutry, Herve, Souriau, Jean-Charles, Brun, Jean, Franiatte, Remi, Nowodzinski, Antoine, Sillon, Nicolas, Dubois-Bonvalot, Beeatrice, Depoutot, Frederic, Brunet, Olivier, Peytavy, AlainYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763616
File:
PDF, 5.39 MB
english, 2008