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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Temporary Bonding and DeBonding Enabling TSV Formation and 3D Integration for Ultra-thin Wafers
Pargfrieder, Stefan, Kettner, Paul, Privett, Mark, Ting, JackYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763610
File:
PDF, 4.11 MB
english, 2008