Polylithic integration of electrical and optical...

IEEE Transactions on Advanced Packaging 2005 / 08 Vol. 28; Iss. 3

Polylithic integration of electrical and optical interconnect technologies for gigascale fiber-to-the-chip communication

Mule', A.V., Villalaz, R.A., Joseph, P.J., Naeemi, A., Kohl, P.A., Gaylord, T.K., Meindl, J.D.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.847838
Date:
August, 2005
File:
PDF, 2.05 MB
english, 2005
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