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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Drop Impact Reliability ¿ A Comprehensive Summary
Wong, E.h., Mai, Y-w, Seah, S.k.w., Rajoo, R., Lim, T.b., Lim, C.t., Field, J.Year:
2006
Language:
english
DOI:
10.1109/hdp.2005.251399
File:
PDF, 441 KB
english, 2006