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[IEEE 2011 IEEE 20th Asian Test Symposium (ATS) - New Delhi, India (2011.11.20-2011.11.23)] 2011 Asian Test Symposium - Multi-visit TAMs to Reduce the Post-Bond Test Length of 2.5D-SICs with a Passive Silicon Interposer Base
Chi, Chun-Chuan, Marinissen, Erik Jan, Goel, Sandeep Kumar, Wu, Cheng-WenYear:
2011
Language:
english
DOI:
10.1109/ats.2011.36
File:
PDF, 522 KB
english, 2011