![](/img/cover-not-exists.png)
[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Aging effects on interfacial reactions between Cu addition into the Sn-9Zn lead-free solder and Au substrate
Liou, Wei-Kai, Yen, Yee-Wen, Jao, Chien-ChungYear:
2009
Language:
english
DOI:
10.1109/impact.2009.5382122
File:
PDF, 1.19 MB
english, 2009