[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Solder constitutive models and failure criteria selection in board level cyclic bending simulation
Li, Xiaoqing, Fu, Xingming, Lou, Minyi, Zhou, Jianwei, Du, Maohua, Chung, MyungkeeYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474730
File:
PDF, 1.96 MB
english, 2012