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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Bump Thermal Management Analysis of LED with Flipchip Package
Sizong, Min, Li Junhui,, Ji-an, Duan, Guiling, DengYear:
2006
Language:
english
DOI:
10.1109/icept.2006.359651
File:
PDF, 6.34 MB
english, 2006