Evidence for 3-D/2-D Transition in Advanced Interconnects

IEEE Transactions on Device and Materials Reliability 2007 / 03 Vol. 7; Iss. 1

Evidence for 3-D/2-D Transition in Advanced Interconnects

Guedj, C., Claret, N., Arnal, V., Aimadeddine, M., Barnes, J. P.
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2007.902172
Date:
March, 2007
File:
PDF, 430 KB
english, 2007
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