[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Evaluation of board level reliability of BGAs under thermal cycling test
Tzeng-Cherng, Luo, Meng-Chieh, Liao, Te-Chun, Huang, Chen-Yu, HuangYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699562
File:
PDF, 282 KB
english, 2010