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[IEEE 2009 IEEE Intrumentation and Measurement Technology Conference (I2MTC) - Singapore. Singapore (2009.05.5-2009.05.7)] 2009 IEEE Intrumentation and Measurement Technology Conference - Thermal stress on silver conductive adhesive solder joints: Performance evaluation of medical ultrasound array transducer
Catelani, Marcantonio, Scarano, Valeria L., Bertocci, Francesco, Singuaroli, Roberto, Palchetti, Paolo, Grandoni, AndreaYear:
2009
Language:
english
DOI:
10.1109/imtc.2009.5168494
File:
PDF, 1.10 MB
english, 2009