Three-dimensional system-in-package using stacked silicon...

IEEE Transactions on Advanced Packaging 2005 / 08 Vol. 28; Iss. 3

Three-dimensional system-in-package using stacked silicon platform technology

Kripesh, V., Seung Wook Yoon,, Ganesh, V.P., Khan, N., Rotaru, M.D., Wang Fang,, Iyer, M.K.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.852895
Date:
August, 2005
File:
PDF, 3.00 MB
english, 2005
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