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[IEEE 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Atlanta, GA, USA (15-17 March 2006)] 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - An Optimal Parametric Design to Improve Chip Cooling
Yung-Shin Tseng,, Hwai-Hui Fu,, Tzu-Chen Hung,, Bau-Shei Pei,Year:
2006
Language:
english
DOI:
10.1109/isapm.2006.1666039
File:
PDF, 2.86 MB
english, 2006