Reliability assessment of electronic components exposed to...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1998 / 6 Vol. 21; Iss. 2

Reliability assessment of electronic components exposed to long-term non-operating conditions

McCluskey, F.P., Hakim, E.B., Fink, J., Fowler, A., Pecht, M.G.
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Volume:
21
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.705484
Date:
June, 1998
File:
PDF, 253 KB
english, 1998
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