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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Study of polyimide as sacrificial layer with O2 plasma releasing for its application in MEMS capacitive FPA fabrication
Ma, Shenglin, Li, Ying, Sun, Xin, Yu, Xiaomei, Jin, YufengYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270696
File:
PDF, 544 KB
english, 2009