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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Thermo-mechanical Reliability Study of High I/Os Flip Chip On Laminated Substrate Based on FEA, RSM and Interfacial Fracture Mechanics
Yingjun Cheng,, Gaowei Xu,, Dapeng Zhu,, Xiaoqin Lin,, Le Luo,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564669
File:
PDF, 478 KB
english, 2005