Real chip size three-dimensional stacked package

IEEE Transactions on Advanced Packaging 2005 / 08 Vol. 28; Iss. 3

Real chip size three-dimensional stacked package

Yamazaki, T., Sogawa, Y., Yoshino, R., Kata, K., Hazeyama, I., Kitajo, S.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.852328
Date:
August, 2005
File:
PDF, 2.66 MB
english, 2005
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