![](/img/cover-not-exists.png)
[IEEE 29th Annual Reliability Physics 1991 - Las Vegas, NV, USA (9-11 April 1991)] 29th Annual Proceedings Reliability Physics 1991 - The effect of metal thickness on electromigration-induced extrusion shorts in submicron technology
Estabil, J.J., Rathore, H.S., Dorleans, F.Year:
1991
DOI:
10.1109/relphy.1991.145987
File:
PDF, 405 KB
1991