[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints
Jenn-Ming Song,, Chien-Wei Su,, Yi-Shao Lai,, Ying-Ta Chiu,Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382227
File:
PDF, 1.00 MB
english, 2009