System-Level Thermal Modeling Using Nonconformal Domain...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 01 Vol. 4; Iss. 1

System-Level Thermal Modeling Using Nonconformal Domain Decomposition and Model-Order Reduction

Jianyong Xie,, Swaminathan, Madhavan
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2286158
Date:
January, 2014
File:
PDF, 2.06 MB
english, 2014
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