[IEEE 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Galati, Romania (2013.10.24-2013.10.27)] 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Investigating the mechanical effect of the solder joint thickness with simulation
Garami, Tamas, Krammer, OliverYear:
2013
Language:
english
DOI:
10.1109/siitme.2013.6743686
File:
PDF, 1.26 MB
english, 2013